As the global leaders in automated post-printing for additive manufacturing, our transformative innovations have warranted the filing of over 50 patent applications worldwide. These pending patent applications encompass the 软件, 硬件, 化学 elements of our full-stack solutions across several technology families, developed for every type of 3D print technology. Read on to learn more about our granted patents, the impact our technology is making to help users reach production scale as we strive to complete additive’s digital thread.
U.S. 专利没有. 10,850,449
“Method and Apparatus for 支持 Removal Using Directed Atomized and Semi-Atomized Fluid”
Granted on December 1, 2020, this U.S. 专利涵盖了皇冠最新手机登录的 Volumetric Velocity Dispersion (VVD) technology found in our DECI and BASE solutions, most often used for finishing Fused Deposition Modeling (FDM) printed parts. Unlike anything else on the market, our VVD technology implements a high-volume, low-pressure spray method to quickly remove support materials from intricate 3D printed polymer parts while keeping their shapes intact.
Controlled by our proprietary 软件 and leveraging our patent-pending chemistries, our testing has shown that this technology enables a 73% average decrease in cycle time compared with a standard tank solution, save additive manufacturing operations significant time and money. Counterparts of this patent are currently pending worldwide.
U.S. 专利 No. 10,737,440
“Apparatus and Method for 支持 Removal”
皇冠最新手机登录的 Submersed Vortex Cavitation (SVC) technology 被正式授予美国国籍.S. 2020年8月11日. 应用于皇冠最新手机登录的流行 黛米200, 黛米400系列, 黛米800系列, 黛米4000系列 support and resin removal solutions, SVC serves as a revolutionary 软件-driven alternative to traditional submersion tanks or blasting. 在这个技术, 3D printed parts are uniformly, 始终如一地, reliably exposed to our optimized, patent-pending detergent as they undergo post-printing by ultrasonic generated cavitations, manned by our vortex pumping scheme.
In testing, the SVC technology has been shown to enable an average breakage rate of a mere 0.1%, compared to an average 3% during the water-blasting process. SVC is revolutionary for improving additive workflow efficiencies, as well as maintaining the integrity of parts. Counterparts of this patent are currently pending worldwide.
U.S. 专利 No. 11,110,661
“Self-Modifying Process for 支持 Removal Using Calibrated Resonant Frequency”
This patent, granted on September 7, 2021, covers the 后处理 AUTOMAT3D® 软件 technology. 的AUTOMAT3D®软件, which is an integral part of all 后处理 systems, senses the progress of post-processing in real-time, makes adjustments to the energy, 搅动, 温度, other operating parameters. This technology provides optimal part finishing results efficiently and 始终如一地. Read more about the capabilities of our 软件 platforms 在这里.
Registration Number: 5,797,326
后处理 was granted the trademark registration of AUTOMAT3D® on July 9, 2019. AUTOMAT3D is the brand name of the proprietary 软件 within every 后处理® solution. 最明显的是, AUTOMAT3D controlled 软件 controls each system’s Agitation Algorithms, which function to boost productivity and minimize breakage by intuitively varying 搅动 intensities, 温度, 处理时间, other process factors on a part-by-part basis.
AUTOMAT3D control 软件 can be accessed on each 后处理 machine via a user-friendly interface. Read more on our pioneering 软件 initiatives 在这里.
Registration Number: 6,240,130
CONNECT3D® was officially registered to 后处理技术 as a trademarked name on January 5, 2021. The CONNECT3D solution is an Industry 4.0 solution and stands as 后处理’s most groundbreaking 软件 innovation. This technology is the first of its kind to connect additive manufacturing’s digital thread beyond the design and print steps. The 软件 allows the 后处理® automated solutions to leverage a part’s native CAD-file or 3D printer sliced files, automatically defining the necessary requirements and algorithms for post-printing. Having been developed for a wide range of materials including metals and polymers, CONNECT3D solution is extremely versatile and imports most native CAD formats.
Explore all that t在这里 is to learn about the CONNECT3D solution 在这里.